scripps oceanography ucsd

Scripps Technical Forum

Next Meeting

Date: Thursday, 26 Jul 2018, 12:00 PM to 1:30 PM
Location: Eckart Sea Cave
*Food and drink provided*
RSVP:  https://goo.gl/iCwvPa

Teledyne Marine Lunch & Learn
Paul Devine
Darryl Symonds
www.teledynemarine.com
 
Please join Teledyne Marine for a lunchtime presentation designed to update you on their latest technology advancements for oceanographic research applications. This 60-minute presentation will include a number of new technologies, including:

Teledyne RD Instruments Acoustic Doppler Current Profilers (ADCPs) – details regarding Sentinel V’s new real-time and bottom track options, with data rates up to 16Hz; as well as a recent case study detailing waves measurement capabilities.

Teledyne RESON’S Parasound Sub-bottom Profiler – introduction to our full range of imaging solutions, with the focus on Parasound for deep-water marine geologic investigations.

Teledyne Benthos R-Series Acoustic Releases – overview of our full line of new R-Series acoustic release hardware and features designed for shallow water to full ocean depth applications.

Teledyne Benthos Acoustic Modems – introduction to our full line of proven A-comms solutions, including our new compact modem with range and bearing capability, ideally suited for small vehicles and/or short-range applications.

Opportunity for 1-1 meetings: Teledyne RDI staff members Paul Devine and Darryl Symonds will also be available for the remainder of the afternoon for group and/or one-on-one meetings to address any in-depth technical questions, concerns, or further details on our ADCPs, or other Teledyne products. To schedule a meeting in advance, please contact
Gwen Nero gnero_at_ucsd.edu x24121

About Teledyne Marine
Teledyne Marine is a group of 23 leading-edge subsea technology companies that are part of Teledyne Technologies Incorporated. Through acquisitions and collaboration over the past ten years, Teledyne Marine has evolved into an industry powerhouse, bringing Imaging, Instruments, Interconnect, Seismic, and Vehicle technology together to provide total solutions to our customers. www.teledynemarine.com

Past Presentations:

2005, 2006, 2007, 2008, 2009, 2010, 2011, 2012, 2013, 2014, 2015, 2016, 2017, 2018

About

The Scripps Technical Forum (STF) is a grassroots effort to make technical expertise and resources more widely available within the UCSD/Scripps community; to enhance communications between technical staff and departments; explore extended opportunities for interdepartmental collaboration, technology transfer, and industry interactions; to explore innovative solutions to emerging challenges; to monitor and disseminate trends and new technologies; and, aid in personnel retention and enhance job satisfaction, including continuing education, and opportunities for job growth.

The group is open to anyone within SIO and UCSD interested in applied technology. We host a semi-monthly midday meeting with free food and an interesting program of presentations given by members of the community and industry.

To receive e-mails of monthly meeting announcements add yourself to the technical list at:

    https://siomail.ucsd.edu/mailman/listinfo/technical

Members of the Technical Forum are encouraged to use the mailing list techicalfoo@siomail.ucsd.edu to get answers from the community on questions about instrumentation, technical setups, electronics, mechanicals, moorings, computers, etc.